Abstract: Atomic layer deposition (ALD) is an advanced precursor vapor-based deposition technique that allows ultra-thin films growth in a precisely controlled manner. ALD provides excellent thickness control and uniformity for the material growth; it also enables 3D structures to be covered with a conformal coating for very high-aspect-ratio structures. The self-limiting nature of the process is a foundation and allows 3D scaling precisely. In addition, the ALD equipment market (several B$) is expected to grow at a CAGR of 25% over the forecast period 2021 to 2026. In contrast, atomic layer etching (ALE) process is opposite to ALD where desired material is removed in an atomic layer-by-layer manner. At preset ALE is urgently needed for the emerging technology nodes where industry is seriously investing in.

In this seminar, I will present both ALD and ALE prospective, material research needs and importance of terms of industry standpoint view.