The Challenge
Next-generation power electronics require new materials and new packaging which pose manufacturing, reliability, and failure challenges. Harsh conditions such as higher power, high temperature, and radiation increase the system architecture risks. Reliable operation of next generation electronic and microelectronic devices is especially critical for the power grid, aerospace, defense, satellites, and hybrid vehicles.
New devices bring the need for early-stage benchmarking and measurement. Software research and algorithms need to be integrated to achieve the energy efficiencies customers demand. The goal is to promote manufacturing of next-generation, energy efficient semiconductor devices and accelerate their adoption.
Argonne’s Solution
Argonne National Laboratory’s researchers are advancing manufacturing technology through in-situ physics-of-device failure studies for power electronic devices and components. These unique capabilities can validate devices faster, reducing test time and cost.
Argonne’s Electronics and Materials Characterization group developed a unique platform to accelerate this testing. It increases reliability of testing by up to 80 percent for power electronics in extreme harsh environments. Using Argonne’s Advanced Photon Source (APS), the group applies x-ray physics, computer science, and electrical engineering to reduce the cost of performing proof-of-concept testing. The result is faster validation of new power electronic devices.
The Impact
Argonne’s reliability characterization and failure analysis will help the semi-conductor industry adopt energy efficient power electronics more quickly.
- Allows for failure avoidance and reliability enhancement
- Improves performance compared to conventional power electronics
- Reduces R&D time and testing cost
- Provides opportunities for early-stage device improvements